{"id":23304,"date":"2026-08-12T11:00:00","date_gmt":"2026-08-12T11:00:00","guid":{"rendered":"https:\/\/scannn.com\/samsung-foundry-updates-process-roadmap-to-move-1-4nm-node-to-2029-high-na-euv-will-enable-1nm-class-and-smaller-nodes-in-2030-and-beyond\/"},"modified":"2026-08-12T11:00:00","modified_gmt":"2026-08-12T11:00:00","slug":"samsung-foundry-updates-process-roadmap-to-move-1-4nm-node-to-2029-high-na-euv-will-enable-1nm-class-and-smaller-nodes-in-2030-and-beyond","status":"publish","type":"post","link":"https:\/\/scannn.com\/lv\/samsung-foundry-updates-process-roadmap-to-move-1-4nm-node-to-2029-high-na-euv-will-enable-1nm-class-and-smaller-nodes-in-2030-and-beyond\/","title":{"rendered":"Samsung Foundry updates process roadmap to move 1.4nm node to 2029 \u2014 high-NA EUV will enable 1nm-class and smaller nodes in 2030 and beyond"},"content":{"rendered":"\n<div id=\"article-body\">\n<p id=\"elk-8af58642-95bf-11f1-b4a9-8b2dd5b3c8ff\">Samsung Foundry presented its updated fabrication technologies roadmap at the 2026 Next-Generation Lithography + Patterning Conference (NGL 2026) this week, revealing some <a data-analytics-id=\"inline-link\" href=\"https:\/\/www.tomshardware.com\/tech-industry\/samsungs-new-roadmap-unveils-its-2nm-process-nodes-and-outlines-backside-power-delivery-plans\" data-url=\"https:\/\/www.tomshardware.com\/tech-industry\/samsungs-new-roadmap-unveils-its-2nm-process-nodes-and-outlines-backside-power-delivery-plans\" data-hl-processed=\"none\" data-article-category=\"tech-industry\" data-mrf-recirculation=\"inline-link\" data-before-rewrite-localise=\"https:\/\/www.tomshardware.com\/tech-industry\/samsungs-new-roadmap-unveils-its-2nm-process-nodes-and-outlines-backside-power-delivery-plans\">major changes compared to the 2024 roadmap<\/a>, reports <a data-analytics-id=\"inline-link\" href=\"https:\/\/zdnet.co.kr\/view\/?no=20260811134353\" data-url=\"https:\/\/zdnet.co.kr\/view\/?no=20260811134353\" target=\"_blank\" referrerpolicy=\"no-referrer-when-downgrade\" data-hl-processed=\"none\" data-article-category=\"tech-industry\" data-mrf-recirculation=\"inline-link\">ZDNet Korea<\/a>. Instead of rushing its SF1.4 node (1.4nm-class) to the market, Samsung will focus on refining its SF2 (2nm-class) manufacturing processes in the next three years. And starting with its SF1A (1nm-class) fabrication node, Samsung intends to adopt High-NA EUV lithography tools, the first time the company confirms the plan.<\/p>\n<p>Before moving on to 10-angstrom (or 1nm-class) node around 2030, Samsung will refine its SF2-series manufacturing technologies (which includes SF2P, SF2X, SF2A, and SF2Z with backside power delivery) and introduce its SF1.4 process in 2029.<\/p>\n<p><a id=\"elk-seasonal\"\/><\/p>\n<aside data-article-category=\"tech-industry\" data-block-type=\"embed\" data-render-type=\"fte\" data-skip=\"dealsy\" data-widget-type=\"seasonal\" class=\"ecom-root\"\/>\n<p id=\"elk-8af58642-95bf-11f1-b4a9-8b2dd5b3c8ff-2\">The delay of SF1.4 from 2027 to 2029 indicates that the company is slowing its leading-edge cadence to focus resources on making its SF2 family more commercially competitive from yields and volumes point of view. Keeping in mind that Samsung has signed <a data-analytics-id=\"inline-link\" href=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/samsung-inks-usd16-5-billion-tesla-ai-chip-deal-elon-musk-says-samsung-will-produce-new-a16-chips-the-strategic-importance-of-this-is-hard-to-overstate\" data-url=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/samsung-inks-usd16-5-billion-tesla-ai-chip-deal-elon-musk-says-samsung-will-produce-new-a16-chips-the-strategic-importance-of-this-is-hard-to-overstate\" data-hl-processed=\"none\" data-article-category=\"tech-industry\" data-mrf-recirculation=\"inline-link\" data-before-rewrite-localise=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/samsung-inks-usd16-5-billion-tesla-ai-chip-deal-elon-musk-says-samsung-will-produce-new-a16-chips-the-strategic-importance-of-this-is-hard-to-overstate\">a long-term supply agreement with Tesla to supply AI5 and AI6 processors through 2033<\/a>, the company&#8217;s priority is to ensure that its major customer is happy.<\/p>\n<div class=\"my-6 w-full overflow-hidden rounded-[10px] lg:my-8\" data-component-name=\"JwPlayer:Carousel\" data-jwp-carousel=\"\" data-jwp-carousel-payload=\"{&quot;ids&quot;:{&quot;playerID&quot;:&quot;3ctY47st&quot;,&quot;searchPlaylistID&quot;:&quot;E849Pwt6&quot;,&quot;divID&quot;:&quot;botr_E849Pwt6_3ctY47st_div&quot;,&quot;fallbackPlaylistID&quot;:&quot;E849Pwt6&quot;,&quot;fallbackDivID&quot;:&quot;botr_E849Pwt6_3ctY47st_div&quot;,&quot;key&quot;:&quot;PQRPe9rcDKVpvWTxi78IpFIsjl2YGAdypF5ix2YVG1nfZtwI&quot;,&quot;tintLogo&quot;:false,&quot;useSearchPlaylist&quot;:false,&quot;enabled&quot;:true},&quot;signPostingEnabled&quot;:true,&quot;signPostingLinkEnabled&quot;:true,&quot;waitForAdLoad&quot;:false,&quot;hidePlayerOnDesktop&quot;:false,&quot;hidePlayerOnMobile&quot;:false,&quot;hidePlayerOnTablet&quot;:false}\">\n<div class=\"flex flex-nowrap items-center justify-between gap-3 bg-zinc-900 px-[14px] py-3\" data-jwp-carousel-header=\"\">\n<p><span class=\"inline-flex items-center gap-1.5 text-sm font-article-heading capitalize leading-5 text-white whitespace-nowrap\"><span class=\"jwp-carousel-title-mobile\"\/><span class=\"jwp-carousel-title-desktop\">Latest Videos From<\/span><span class=\"jwp-carousel-brand\">Tom&#8217;s Hardware<\/span><\/span><\/p>\n<\/div>\n<\/div>\n<p>Another reason for a long SF2 lifespan is the company&#8217;s reported plan to <a data-analytics-id=\"inline-link\" href=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/samsungs-taylor-texas-fab-could-herald-a-breakthrough-for-the-chipmaker-company-plans-2026-risk-production-new-production-flows-pellicles-for-euv-patterning-as-site-targets-50-000-wspm\" data-url=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/samsungs-taylor-texas-fab-could-herald-a-breakthrough-for-the-chipmaker-company-plans-2026-risk-production-new-production-flows-pellicles-for-euv-patterning-as-site-targets-50-000-wspm\" data-hl-processed=\"none\" data-article-category=\"tech-industry\" data-mrf-recirculation=\"inline-link\" data-before-rewrite-localise=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/samsungs-taylor-texas-fab-could-herald-a-breakthrough-for-the-chipmaker-company-plans-2026-risk-production-new-production-flows-pellicles-for-euv-patterning-as-site-targets-50-000-wspm\">finally adopt pellicles for EUV photomasks<\/a>, which changes the usual routines at Samsung and likely forces it to reconsider process recipes for some of its future nodes.<\/p>\n<p>Interestingly, but Samsung&#8217;s 1nm-class node is said to co-exist with SF1.4+, an enhanced version of SF1.4 that uses an unusual nomenclature for Samsung. Such an approach indicates that the company will have both an &#8220;innovative&#8221; 1nm-class process that uses High-NA EUV lithography and a technology that relies on proven Low-NA EUV flows and materials.<\/p>\n<aside data-component-name=\"Recirculation:ArticleRiver\" data-recirculation-type=\"inline\" data-mrf-recirculation=\"Trending Bar\" data-nosnippet=\"\" class=\"clear-both pt-2 pb-0 mb-4\">\n        <span class=\"&#10;            flex&#10;            after:content-[''] after:flex-1 after:ml-4 after:my-[0.7rem] after:border-t after:border-solid after:border-t-[#ccc]&#10;            before:content-[''] before:flex-1 before:mr-4 before:my-[0.7rem] before:border-t before:border-solid before:border-t-[#ccc]&#10;            font-article-heading pb-0 text-[length:var(--article-river-title--font-size,1em)] uppercase sm:text-[length:var(--article-river-title--font-size,0.875em)] font-bold&#10;        \"><br \/>\n            You may like<br \/>\n        <\/span><\/p>\n<\/aside>\n<p>Although Samsung has purchased an ASML Twinscan EXE:5000 EUV lithography scanner with 0.55 numerical aperture projection optics and has been using it for research purposes for well over a year, the company is not in any rush to adopt High-NA EUV lithography for its 2nm-class and 1.4nm-class fabrication technologies. Samsung only plans to insert such a tool for its 1nm-class process sometime in 2030.<\/p>\n<p>&#8220;We wanted to apply High-NA EUV to mass production at nodes such as 2nm and 1.4nm, but the technology still requires further improvements,&#8221; said Chang Min Park, Master VP of Technology at Samsung Electronics, at the conference. &#8220;We believe High-NA EUV will become necessary from A10 and below, and we are conducting joint development with various partners.&#8221;<\/p>\n<div id=\"slice-container-newsletterForm-articleInbodyContent-HBnik4iwYzc2Eb3euezJjS\" class=\"slice-container newsletter-inbodyContent-slice newsletterForm-articleInbodyContent-HBnik4iwYzc2Eb3euezJjS slice-container-newsletterForm\">\n<div data-hydrate=\"true\" class=\"newsletter-form__wrapper newsletter-form__wrapper--inbodyContent\">\n<div class=\"newsletter-form__container\">\n<section class=\"newsletter-form__top-bar\"\/>\n<section class=\"newsletter-form__main-section\">\n<p class=\"newsletter-form__strapline\">Get Tom&#8217;s Hardware&#8217;s best news and in-depth reviews, straight to your inbox.<\/p>\n<\/section>\n<\/div>\n<\/div>\n<\/div>\n<p>For chipmakers, the main challenge with ASML&#8217;s High-NA EUV tools are substantially higher costs compared to Low-NA EUV systems used today, which greatly increases costs of fabs and can affect costs of chips. Meanwhile, High-NA EUV scanners introduce a smaller exposure field, which can require die stitching for large chips and complicate designs, which largely diminish their performance advantage over regular Low-NA EUV systems that stems on reducing the need for using multipatterning.<\/p>\n<p>In addition, High-NA EUV needs improved photoresists, different masks, pellicles, metrology, inspection, and computational lithography, just to name some of the requirements. As a result, chipmakers must determine when it makes sense for them to use expensive single-patterning on High-NA EUV tools and when they can live with increasingly mature 0.33-NA EUV multi-patterning. For example, Intel intends use High-NA EUV tools with some of its 14A technologies, whereas TSMC looks at High-NA EUV lithography as on technology for the 2030s.<\/p>\n<p><a href=\"https:\/\/news.google.com\/publications\/CAAqLAgKIiZDQklTRmdnTWFoSUtFSFJ2YlhOb1lYSmtkMkZ5WlM1amIyMG9BQVAB\" id=\"elk-8af58750-95bf-11f1-8f4e-a9b9b4aa1c25\" data-url=\"https:\/\/news.google.com\/publications\/CAAqLAgKIiZDQklTRmdnTWFoSUtFSFJ2YlhOb1lYSmtkMkZ5WlM1amIyMG9BQVAB\" target=\"_blank\" referrerpolicy=\"no-referrer-when-downgrade\" data-hl-processed=\"none\" data-article-category=\"tech-industry\"><\/p>\n<figure class=\"van-image-figure pull-left inline-layout\" data-bordeaux-image-check=\"\">\n<div class=\"image-full-width-wrapper\">\n<div class=\"image-widthsetter\" style=\"max-width:676px;\">\n<p class=\"vanilla-image-block\" style=\"padding-top:31.51%;\"> <picture data-new-v2-image=\"true\"><source type=\"image\/webp\" srcset=\"https:\/\/cdn.mos.cms.futurecdn.net\/7cUTDmN2PHNRiNBVqbKf56-676-80.png.webp 1200w, https:\/\/cdn.mos.cms.futurecdn.net\/7cUTDmN2PHNRiNBVqbKf56-676-80.png.webp 1024w, https:\/\/cdn.mos.cms.futurecdn.net\/7cUTDmN2PHNRiNBVqbKf56-676-80.png.webp 970w, https:\/\/cdn.mos.cms.futurecdn.net\/7cUTDmN2PHNRiNBVqbKf56-650-80.png.webp 650w, https:\/\/cdn.mos.cms.futurecdn.net\/7cUTDmN2PHNRiNBVqbKf56-480-80.png.webp 480w, https:\/\/cdn.mos.cms.futurecdn.net\/7cUTDmN2PHNRiNBVqbKf56-320-80.png.webp 320w\" sizes=\"(min-width: 1000px) 970px, calc(100vw - 40px)\"\/>\n<\/picture><\/p>\n<\/div>\n<\/div>\n<\/figure>\n<p><\/a><\/p>\n<p id=\"elk-8af587d2-95bf-11f1-a71d-cf484d38484b\"><em>Follow<\/em><a data-analytics-id=\"inline-link\" href=\"https:\/\/news.google.com\/publications\/CAAqLAgKIiZDQklTRmdnTWFoSUtFSFJ2YlhOb1lYSmtkMkZ5WlM1amIyMG9BQVAB\" target=\"_blank\" data-url=\"https:\/\/news.google.com\/publications\/CAAqLAgKIiZDQklTRmdnTWFoSUtFSFJ2YlhOb1lYSmtkMkZ5WlM1amIyMG9BQVAB\" referrerpolicy=\"no-referrer-when-downgrade\" data-hl-processed=\"none\" data-article-category=\"tech-industry\" data-mrf-recirculation=\"inline-link\"><em> Tom&#8217;s Hardware on Google News<\/em><\/a><em>, or<\/em><a data-analytics-id=\"inline-link\" href=\"https:\/\/google.com\/preferences\/source?q=\" target=\"_blank\" data-url=\"https:\/\/google.com\/preferences\/source?q=\" referrerpolicy=\"no-referrer-when-downgrade\" data-hl-processed=\"none\" data-article-category=\"tech-industry\" data-mrf-recirculation=\"inline-link\"><em> add us as a preferred source<\/em><\/a><em>, to get our latest news, analysis, &amp; reviews in your feeds.<\/em><\/p>\n<\/div>\n<p><a href=\"https:\/\/www.tomshardware.com\/tech-industry\/samsung-foundry-updates-process-roadmap-to-move-1-4nm-node-to-2029-high-na-euv-will-enable-1nm-class-and-smaller-nodes-in-2030-and-beyond?utm_source=tldrhardware\">Source link <\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Samsung Foundry presented its updated fabrication technologies roadmap at the 2026 Next-Generation Lithography + Patterning Conference (NGL 2026) this week, revealing some major changes compared to the 2024 roadmap, reports ZDNet Korea. Instead of rushing its SF1.4 node (1.4nm-class) to the market, Samsung will focus on refining its SF2 (2nm-class) manufacturing processes in the next [&hellip;]<\/p>\n","protected":false},"author":16,"featured_media":23305,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[143],"tags":[],"class_list":["post-23304","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-ai"],"_links":{"self":[{"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/posts\/23304","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/users\/16"}],"replies":[{"embeddable":true,"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/comments?post=23304"}],"version-history":[{"count":0,"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/posts\/23304\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/media\/23305"}],"wp:attachment":[{"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/media?parent=23304"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/categories?post=23304"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/scannn.com\/lv\/wp-json\/wp\/v2\/tags?post=23304"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}